Technical Advantages of Carrier

  • Dimensionally stability under extreme process conditions
  • Save wafer processing down to 120 μm thickness
  • Injection molded design with smooth surface finish
  • Low chemical carry over design
  • Homogeneous etching with minimum shadowing and prevention of carrier marks
  • Optimal rinse and spot-free drying performance
  • Carrier up-flow prevention by proper weight & by SINGULUS wet process equipment
  • Capacity max. 100 wafers, 6 point fixing – pitching 4,76 mm
  • Wafer up-flow protection and additional wafer alignment by patent-pending retainer design
  • RFID carrier identification

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