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Vacuum Deposition Technology at a Glance

SINGULUS TECHNOLOGIES has delivered far more than 8,000 vacuum coating machines since its foundation in 1995. The tools range from compact systems for optical disc replication to ultra-high vacuum coating machines applying extremely thin layers of around 0.2 nm for the semiconductor industry as required for the manufacturing of MRAM chips.

In addition, vacuum thin-film technology is used in modern sensory technology for medical uses and in vehicle technology as well as for piezoelectric materials in mobile phone technology.

SINGULUS develops innovative technologies for economic and resource-efficient production processes and the strategy is based on the use and expansion of its existing core competencies. The range of use of machines built by SINGULUS TECHNOLOGIES includes vacuum thin-film and plasma coating, wet-chemical cleaning and etching processes as well as thermal processing technology.

For all machines, processes and applications, SINGULUS TECHNOLOGIES utilizes its know-how in the areas of automation and process technology in order to provide additional, attractive work areas with innovative products for use in the existing application areas of Solar, Semiconductors and Medical Devices.




Inline PECVD System for AlOx and SiNy Deposition on PERC Solar Cells

One main focus during solar cell production is on cost per Wp. Passivated emitter and rear cell technology (PERC) is a comparatively low-cost approach to achieve conversion efficiencies of close to 22 %. The newly developed GENERIS PECVD system is a horizontal inline tool designed for the special needs in photo- voltaic mass production.

PERC solar cells are coated on both sides with dielectric passivation layers. Rear side passivation is achieved by deposition of a thin AlOx-layer capped by SiNy. On the front side, a layer of SiNx serves for both, passivation and anti-reflective coating (ARC). The system is ideally suited for cost effective mass production with high uptime, short cleaning interruptions and maximum utilization of raw materials. Full substrate temperature control during the whole process enables optimum layer performance at temperatures in the range of 450 °C.


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